Qualcomm recently confirmed to launch its next generation flagship mobile chipset – Snapdragon 8 Gen 2 on November 15 this year and now the specification details of the upcoming flagship mobile chipset surfaced online. So without making any further delay let’s dive into the article to check out the complete details.
According to the newly surfaced information, the upcoming mobile chipset will be manufactured by only TSMC and the upcoming chipset is believed to use TSMC’s 4nm node. If you are not aware then it is the same node on which the Snapdragon 8+ Gen 1 is made.
It was previously reported that Snapdragon 8 Gen 2 will have a “1 + 2 + 2 + 3” cluster. It will also feature a high-performance core codenamed Makalu, two Makalu cores, two Matterhorn cores, and three Klein R1 cores.
The upcoming Snapdragon 8 Gen 2 is also believed to have Qualcomm’s most recent Snapdragon X70 5G modem. So let’s wait for more details of the upcoming mobile flagship chipset in the coming weeks and we recommend you to stay tuned with us for more information from the technological world at your fingertips.
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